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Monday, December 17, 2012

The launch of Avago 4G LTE mobile infrastructure equipment for high gain linear power amplifier


Avago Technologies recently announced the launch of a high gain, high linearity power amplifier, for 700-800 MHz mobile infrastructure equipment to provide high data rate applications. This new high linear amplifier for MGA-43128 LTE AP, CPE and Picocell equipment to provide excellent signal transmission quality and low power consumption, but also can be used as a base station driver amplifier.
MGA-43128 in the design to high data rate transmission while providing excellent signal quality, it has low distortion and high power added efficiency ( PAE ) characteristics, helps to reduce the power consumption. RF input match exactly, output includes built-in a matching circuit, can make the matching and application of simplified. The device is equipped with a built-in bypass switch control attenuator, and can provide up to 18 dB attenuation, but also with the temperature compensated power detector.
The latest MGA-43128 device using a proprietary Avago 0.25 µ m GaAs enhancement patterns of pHEMT technology to achieve the linear output power, can be a single 5V power supply, can reach 3.3V. 700MHz MGA-43128 following the prior to the release of the MGA-43228 and the MGA-43328 power amplifier (respectively, 2300-2500 MHz and 2500-2700 MHz ), has become the Avago 29 dBm linear power amplifier in a new member of the family. In the series of all devices have generic package structure, further simplifying the design.
MGA-43128 with 5 x 5 x 0.85 mm miniature surface mount 28 lead QFN package, available at -40° C to +85 °C between the temperature range for operation. The QFN package using lead-free and halogen-free materials, moisture sensitivity of MSL-2a standard, so the bag and landing on the ground around the life of up to.
Other MGA-43128 product characteristics
high gain, 33.4 dB
high linear performance, 2.5% error vector magnitude ( EVM ) linear power output is 29.1 dBm
• 750: MHz efficient linear power output at PAE 22%
• can switch control gain of function: the use of a CMOS compatible single switch pin can achieve 18 dB attenuation
with output power of 29 dBm 3GPP spectral mask standard
power shutdown shutdown current <50 uA
built-in output power detector

Sunday, December 16, 2012

Molex enhanced zSFP+ SMT 20 interconnect solutions for the 25 Gbps data and telecommunications applications


Leading a full set of interconnect products supplier Molex company launched enhanced small size plug in + ( zSFP+ ) surface mount technology ( SMT ) 20 way connector, can provide high speed telecommunications and data communications equipment to provide excellent performance. Model of zSFP+ interconnect components designed for high-speed Ethernet and fibre channel in 25 Gbps serial channel and design, can be extended for the next generation of applications, and in the 10 and 16 Gbps channels to provide the best electromagnetic interference ( EMI ) and signal integrity ( SI ) allowance.
Backward compatible zSFP+ connector and SFP+ connector has the same shape and size of mating interface and the EMI shield size, with the insert molding technology of priority combination type ( preferential coupling ) design and narrow edge coupled blanking and forming contact shape, achieving an excellent signal, mechanical and electrical properties, as compared to the current SFP+ products, greatly reducing the resonance. Model of zSFP+ interconnect system component includes: zSFP+ SMT 20 way connector, laminate (stacked ) integrated connector and passive optical fiber cable assemblies.
Molex new product development manager Joe Dambach said: " SFP connector and stacked integrated connector are introduced. The main design improvement and optimization to achieve next generation application performance. At the central office and multi platform data system, a new zSFP+ SMT technology for memory, switches, routers and hubs provide upgrade and design of fully integrated solution. "
ZSFP+ SMT 20 way connector having the same PCB occupying area, inserted with interface and the EMI shield size, can be used as the current SFP+ dimension motherboard design universal ( drop-in ) to replace a product, achieve complete backward compatibility. The high temperature thermoplastic shell can withstand lead-free process, one port and group 1x transfer (ganged) shield support multiple port number selection and application, with the SFP+ shield considerable cost, and different thickness of the board and the assembly process shared servers and switches, satisfy application demands. Group of adjustable shield with two, four or six port, used for a variety of design options.
Stacked integrated connector and the shielding cover can be used for pressing type applications, save the backflow assembly and provides a space saving compact design, easy processing. Internal shielded longitudinal provides incomparable EMI reduction performance. Pressing type suitable for front end on the front ( belly-to-belly ) applications, for individual and group adjustable shield, with a view to achieving the printed circuit board ( PCB ) space to maximize the use of. An optional rear and side mounted light pipe cover assembly allows a flexible arrangement of LED PCB signal routing, to provide users with the port status and feedback.
Using OM3/OM4 fiber Molex fiber LC twin cable assemblies using zSFP+ optical module, to provide a high performance interconnect solutions, with a custom length selection and includes vertical, 45 degrees and 90 degrees angle strain relief guide. The use of OM3/OM4 fiber LC duplex connector provides the next generation of zSFP+ equipment needed for higher transmission bandwidth, the connector to meet EIA-TIA and FOCIS 10 standard and applicable to MSA equipment.
Dambach added: " the enhanced zSFP+ connector products for the new 25 Gbps design provides excellent connector, and Molex customers already in the current low board implementation of enhanced zSFP+ solutions obtained without additional signal integrity margin benefit. "

Saturday, December 15, 2012

Opnext offer built-in monitor photodiode 660nm high power red laser diode


On February 15, 2012, Fremont California - the United States of America business information - Opnext month launched with a built-in monitor photodiode 660nm high power laser. Opnext HL65051DG red laser diode, is for the lidar ( laser imaging detection and ranging ), plastic optical fiber ( POF ) communication application and design, by monitoring the laser performance and real-time adjustment of output power, to achieve best product performance and output.
Using a unique patented design for HL65051DG red laser diodes, and published last January in the same with a built-in monitoring ability of the HL63142DG to the Opnext together with the laser diode series. The built-in monitor can let the system designer, through a monitoring photodiode current and regulating the temperature and power supply variations to control its optical properties. In laser imaging detection and ranging applications and POF communications applications, performance monitoring for the maintenance of constant power output of the laser is became an essential function. HL65051DG operating temperature up to 60.
Opnext equipment business department President Tadayuki Kanno said: " we expect to see the industrial areas of application for such high quality laser products initial needs, current industry trends are predisposed to high power and low loss of the laser diode, and Opnext has been in constant innovation, promote the key performance in market development. "

Friday, December 14, 2012

Finisar launched two new polarization-maintaining programmable optical filter


On February 24, 2012, Finisar in February 22nd the company announced the launch of two new WaveShaper programmable optical filter -- WaveShaper 1000S/SP and 1000M/SP.
WaveShaper 1000S/SP and 1000M/SP is a polarization-maintaining programmable filter, can control the amplitude and phase of C-band full band. This filter is designed for use in medical, material processing and communication system testing field of pulse laser design. In the medical and material processing system application, WaveShaper filter can precisely control the laser pulse waveform and timing. Provide a shorter period and more stable laser pulses, thereby effectively improving the accuracy and productivity of production. Involving the polarization multiplexing and coherent optical communication systems technology application, WaveShaper 1000/SP can independently control each polarization signal.