Leading a full set of interconnect products supplier Molex company launched enhanced small size plug in + ( zSFP+ ) surface mount technology ( SMT ) 20 way connector, can provide high speed telecommunications and data communications equipment to provide excellent performance. Model of zSFP+ interconnect components designed for high-speed Ethernet and fibre channel in 25 Gbps serial channel and design, can be extended for the next generation of applications, and in the 10 and 16 Gbps channels to provide the best electromagnetic interference ( EMI ) and signal integrity ( SI ) allowance.
Backward compatible zSFP+ connector and SFP+ connector has the same shape and size of mating interface and the EMI shield size, with the insert molding technology of priority combination type ( preferential coupling ) design and narrow edge coupled blanking and forming contact shape, achieving an excellent signal, mechanical and electrical properties, as compared to the current SFP+ products, greatly reducing the resonance. Model of zSFP+ interconnect system component includes: zSFP+ SMT 20 way connector, laminate (stacked ) integrated connector and passive optical fiber cable assemblies.
Molex new product development manager Joe Dambach said: " SFP connector and stacked integrated connector are introduced. The main design improvement and optimization to achieve next generation application performance. At the central office and multi platform data system, a new zSFP+ SMT technology for memory, switches, routers and hubs provide upgrade and design of fully integrated solution. "
ZSFP+ SMT 20 way connector having the same PCB occupying area, inserted with interface and the EMI shield size, can be used as the current SFP+ dimension motherboard design universal ( drop-in ) to replace a product, achieve complete backward compatibility. The high temperature thermoplastic shell can withstand lead-free process, one port and group 1x transfer (ganged) shield support multiple port number selection and application, with the SFP+ shield considerable cost, and different thickness of the board and the assembly process shared servers and switches, satisfy application demands. Group of adjustable shield with two, four or six port, used for a variety of design options.
Stacked integrated connector and the shielding cover can be used for pressing type applications, save the backflow assembly and provides a space saving compact design, easy processing. Internal shielded longitudinal provides incomparable EMI reduction performance. Pressing type suitable for front end on the front ( belly-to-belly ) applications, for individual and group adjustable shield, with a view to achieving the printed circuit board ( PCB ) space to maximize the use of. An optional rear and side mounted light pipe cover assembly allows a flexible arrangement of LED PCB signal routing, to provide users with the port status and feedback.
Using OM3/OM4 fiber Molex fiber LC twin cable assemblies using zSFP+ optical module, to provide a high performance interconnect solutions, with a custom length selection and includes vertical, 45 degrees and 90 degrees angle strain relief guide. The use of OM3/OM4 fiber LC duplex connector provides the next generation of zSFP+ equipment needed for higher transmission bandwidth, the connector to meet EIA-TIA and FOCIS 10 standard and applicable to MSA equipment.
Dambach added: " the enhanced zSFP+ connector products for the new 25 Gbps design provides excellent connector, and Molex customers already in the current low board implementation of enhanced zSFP+ solutions obtained without additional signal integrity margin benefit. "
No comments:
Post a Comment